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Module title Optoelectronics R1a
Courses Title Type his-lsf course identifier SWS Credits Performance requirements/Examination
Microsystem Technology (lec) lecture FB16-5267 2 3 oral exam (30 minutes)
Technology of Electronic and Optoelectronic Devices (lec) lecture FB16-8500 2 3 oral exam (30 minutes)
Module credits 6
Language English
Held in summer semester, annually
Lecturer Hillmer and team
Responsibles(s) Hillmer
Required qualifications Basic knowledge on semiconductor devices (transistor, laser diode, LED, photo diode),
material science and optics
Workload 60 hours course attendance
120 hours self-study
Contents
  • Introduction to modern fabrication processes, technology of fibers, wave guides,
    lasers
  • Crystal growth: semiconductor wafers, thin layer epitaxy
  • Lithography: optical, X-ray, electron-beam, ion-beam, EUVL, nano imprint
  • Plasma processing and vacuum technology
  • Deposition techniques: evaporation, sputtering, plasma assisted techniques
  • Dry and wet-chemical etching and clean room technology
  • Fabrication technology of electronic devices (planar transistor, electronic integrated
    chips), optoelectronic devices (semiconductor lasers, gratings) and micro-optoelectro-
    mechanical systems (MOEMS)
  • Introduction to micromachining, microsystem techniques, miniaturization, packaging
    and nanotechnology
  • Reasons for miniaturization and integration, types of micromachining
  • Sensors and actuators
  • Large variety of MEMS and MOEMS examples: membranes, springs, resonator
    elements, cantilevers, valves, manipulation elements, gripping tools, light
    modulators, optical switches, beam splitters, projection displays, micro optical
    bench, data distribution, micromachined tunable filters and lasers
  • Displays: micromachined (micromirror) displays, laser display technology, vacuumelectronics
  • Lab tour in the clean room.
Literature
  • R. Williams, Modern GaAs Processing Methods, Artech House Inc.,
    ISBN 0-89006-343-5, 1990.
  • W. Menz, J.Mohr and O. Paul, Microsystem Technology, VCH-Verlag, 2001.
  • K. Iga, S. Kinoshita, Process technology for semiconductor lasers, Springer, Series
    in Material Science 30, 1996.
  • B. Bhushan (Editor), Springer Handbook of Nanotechnology, Springer, 2004.
Media Beamer (presentation), black board (derivations, explanations), paper (exercises).
Objectives
  • Understanding the fundamentals in micromachining, micro-opto-electro-mechanical
    systems (MOEMS) and optical MOEMS
  • Understanding the fundamentals of semiconductor technology including specific
    processes, schemes and required instrumentation
  • Methodology, interdisciplinary aspects, future perspectives and market trends
  • Finding solutions using interdisciplinary analogies
  • Establishing synergies between engineering disciplines and natural sciences
  • Introduction to the 21st century as the “century of photonics and nano technology”.
Competences to be acquired
  • Knowledge in micromachining, devices, thin layer and clean room technologies
  • Methodology in specialized miniaturization schemes and integration of electronic
    and optoelectronic devices and systems
  • Knowledge of design, fabrication and use of nanoelectronic, (opto-)electronic and
    micromachined devices.